
Future Home of North America’s Most Advanced Publicly Owned High NA EUV Lithography Equipment Which Will Develop and Reshore the Next Generation of Semiconductor Technology
Governor’s Investment Secures $9 Billion in Private Investment and New York’s Role as a Global Leader in Next-Generation Semiconductor Chip R&D
Governor Kathy Hochul today announced the “topping out” of NanoFab Reflection, the cornerstone of the Governor’s $1 billion investment in NY Creates’ Albany NanoTech Complex, marking a major milestone for the $10 billion initiative and for New York State’s strategy to strengthen America’s semiconductor leadership. The new facility will be the home of the nation’s first publicly owned, High NA EUV Lithography Center, with the most advanced chip research and development capabilities anywhere in the world.
The 310,000 square foot NanoFab Reflection is a key component of the Governor’s semiconductor strategy and investment in growing NY Creates’ Albany NanoTech Complex, which is already the nation’s premier public–private semiconductor R&D hub. The project will support hundreds of new permanent high-tech jobs, generate $9 billion in private investment, and harness the power of expanded partnerships with universities, workforce programs, and global semiconductor companies. The topping out ceremony marks the installation of the final steel beam of the NanoFab Reflection structure, highlighting its on-schedule construction progress. Completion of the building is anticipated by the end of next year.
“With this milestone, we are taking a major step toward securing the future of advanced chip research right here in New York State,” Governor Hochul said. “This $1 billion investment I secured for NY Creates, paves the way for good jobs, stronger communities, and an innovation economy that keeps our state competitive on the global stage."
NanoFab Reflection will include 50,000 square feet of state-of-the-art cleanroom space, built to support the most demanding and leading-edge semiconductor R&D work in the world. The facility will house ASML’s High NA EUV lithography equipment, the world’s most advanced tool for printing the tiny features that power next-generation chips. The new High NA EUV lithography equipment, scheduled to arrive at the Albany NanoTech Complex in mid-2026, will be able to make chips more powerful and faster to meet ever increasing computing needs while making them more energy efficient.
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